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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA112B/YSBKS.X-PF
DATA SHEET
DOC. NO : QW0905-LA112B/YSBKS.X-PF REV. DATE : A
: 02 - Feb. - 2008
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 1/6
Package Dimensions
4.3 2.50.5 O 3.2 8.2
YSBKS
5.0
2.9
9.6
X
2.65
0.5 TYP
2.54TYP
3.20.3
4.450.5
SBKS
1
2
1
6.990.5
Y 2
LYSBKS2662/R1-PF
2.9 3.1
3.3 1.5MAX
4.3
SBKS
0.5 TYP
25.0MIN
1
Y 2
1
2
1.0MIN 2.54TYP
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 2/6
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol Y Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 20 80 60 10 ---20 ~ +80 -30 ~ +100 SBKS 30 100 120 50 500 mA mA mW UNIT
A
V

Electricity or power surge will the Use of anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly glove these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL
COLOR
Pnm Dnm
Peak Dominant Spectral wave wave halfwidth length length nm Lens
Forward voltage @20mA(V)
Viewing Luminous intensity angle @20mA(mcd) 2 1/2 (deg)
Emitted GaAsP/GaP Yellow
LA112B/YSBKS.X-PF
Min. Typ. Max. Min. Typ. 585 ---475 35 26 1.7 ------3.5 2.6 4.2 21 65 38 120 50 50
White Diffused
InGaN/SiC Blue
----
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 3/6
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
100 10 1.0
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0 0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 4/6
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.1 Forward current vs. Forward Voltage
30 25 20 15 10 5 0 1 2 3 4 5
Fig.2 Relative Intensity vs. Forward Current
Forward Current(mA)
1.5
Relative Intensity Normalize @20mA
1.25 1.0 0.75 0.5 0.25 0 0 5 10 15 20 25 30
Forward Voltage(V)
Forward Current(mA)
Fig.3 Forward Current vs. Temperature
Fig.4 Relative Intensity vs. Wavelength
Forward Current@20mA
30 20 10 0 0 25 50 75 100
Relative Intensity@20mA
40
1.0
0.5
0 380
430
480
530
580
630
680
Ambient Temperature()
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat
60 Seconds Max
25 0 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/YSBKS.X-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95 % 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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